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LEARN PCB
PCB Manufacturing
PCB Assembly
PCB Design and Layout
PCB Basics
Vias, Drilling & Throughplating
Mechanics
Surface
SMD
Quality
SPECIFICATIONS
PCB Fabrication
STANDARDS & POLICY
PCB Ordering
Policy

Surface-mount devices are mounted directly to a PCB. These components are smaller than the through-hole components and comprise a small lead or no lead at all. Since SMD components require fewer drilled holes, they incorporate higher routing density and the design becomes more compact.

There are many SMD components of different package sizes with various functionalities. They can be placed on both sides of the circuit board along with a higher component density with more connections possible per component to attain higher speed. Here, we will briefly introduce some of them.

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SMD passive components consist of resistors, capacitors, and inductors with a rectangular package. Diodes are also part of this but are two-terminal active devices. Diodes can be miniaturized and packaged according to the following SMD sizes.

Chip package typeDimensions in mmDimensions in inches
010050.4 x 0.20.016 x 0.008
0150150.38 x 0.380.014 x 0.014
02010.6 x 0.30.02 x 0.01
02020.5 x 0.50.019 x 0.019
024040.6 x1.00.02 x 0.03
03030.8 x 0.80.03 x 0.03
04021.0 x 0.50.04 x 0.02
06031.5 x 0.80.06 x 0.03
08052.0 x 1.30.08 x 0.05
10082.5 x 2.00.10 x 0.08
11112.8 x 2.80.11 x 0.11
12063.0 x 1.50.12 x 0.06
12103.2 x 2.50.125 x 0.10
18064.5 x 1.60.18 x 0.06
18084.5 x 2.00.18 x 0.07
18124.6 x 3.00.18 x 0.125
18254.5 x 6.40.18 x 0.25
20105.0 x 2.50.20 x 0.10
25126.3 x 3.20.25 x 0.125
27256.9 x 6.30.27 x 0.25
29207.4 x 5.10.29 x 0.20

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An electronic project is incomplete without a proper connector. In surface-mount technology, SMA and SMB connectors are mostly used for board assembly. SMA and SMB stand for sub-miniature version A and sub-miniature version B.

TypePropertiesApplication
SMA1. Semi-precision
2. Coaxial RF connector
3. Impedance 50Ω
4. Electrical use from DC (0 GHz) to 12 GHz,
but extended to 18 GHz and 26.5 GHz
1. Microwave systems
2. Hand-held radio
3. Mobile telephone antennas
4. WiFi antenna systems
SMB1. Semi-precision
2. Coaxial RF connector
3. Impedance 50Ω or 75Ω
4. Electrical use from DC(0 GHz) to 4 GHz
5. Smaller than SMA
1.Telecommunications
2. Test equipment
3. Instrumentation
4. GPS

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Tantalum capacitors do have very high capacitance with very small packaging. These capacitors give the best results in high-capacitance, low-current environments.

Package typeDimensions in mmEIA standard
Size A3.2 x 1.6 x 1.6EIA 3216-18
Size B3.5 x 2.8 x 1.9EIA 3528-21
Size C6.0 x 3.2 x 2.2EIA 6032-28
Size D7.3 x 4.3 x 2.4EIA 7343-31
Size E7.3 x 4.3 x 4.1EIA 7343-43

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A small outline transistor is a discrete surface-mount transistor that is majorly used in consumer electronics. Here are some commonly used SOTs.

Package typeDimensions in mmTerminal
SOT-233 × 1.75 × 1.33
SOT-2236.7 × 3.7 × 1.84
SOT-3232.1 x 2.1 x 0.94
SOT-5231.6 x 1.6 x 0.74

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We can see some popular SMD transistors other than SOT here.

TO-252-3 (DPAK)

to-252-3-pcb-transistor.jpg
Image credit: Digi-Key Electronics

TO-92

pcb-transistor-to-92.jpg
Image credit: Digi-Key Electronics

TO-263

smd-transistor-to-263.jpg
Image credit: Digi-Key Electronics

 

BC-547

pcb-transistor-bc-547.jpg
Image credit: Digi-Key Electronics

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ICs are enclosed in a package for protection. Here we will see some important IC packages, their properties, and applications.

Package type

PropertiesApplication
SOIC1. Small outline integrated circuit
2. Surface-mount equivalent of the classic through-hole DIP (Dual-Inline Package)
1. Standard package for logic IC
TSSOP1. Thin shrink small outline package
2. Rectangular surface mount
3. Plastic integrated circuit (IC) package
4. Gull-wing leads
1. Analog amplifiers,
2. Controllers and Drivers
3. Logic devices
4. Memory devices
5. RF/Wireless
6. Disk drives
QFP1. Quad flat package.
2. Easiest option for high pin-count components
3. Easy to inspect by AOI
4. Assembled with standard reflow soldering
1. Microcontrollers
2. Multi-channel codecs
QFN1. Quad flat no-lead
2. Electrical contacts do not come out of the component
3. Smaller than QFP
4. Require extra attention in PCB assembly
1. Microcontrollers.
2. Multi-channel codecs
PLCC1. Plastic leaded chip carrier
2. Allow components to be directly mounted on the PCB
1. Prototype PCB assembly
BGA1. Ball grid array
2. Most complex
3. High-pin count component
4. Electrical components are below silicon IC
5. Requires reflow soldering for PCB assembly
1. High-speed microprocessor
2. Field programming gate array(FPGA)
POP1. Package-on package technology
2. Stacked on the top of others
1. Used for memory devices and microprocessors.
2. High-speed design, HDI design

SMD components ensure a smaller form factor design. The manufacturing cost is minimized and board space can be efficiently optimized by incorporating these components. Indeed, SMD packages are the better choice over through-hole components while designing a sleek, compact, high-speed, or HDI board.

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